Smiths Interconnect announces the introduction of an innovative spring probe contact technology for Kelvin test of packaged devices down to 0.35mm pitch. The key design advancement of this new spring probe contact technology is the beveled tip offset point that allows for tighter centers, down to 0.25 mm, on the device pad.
 
Kelvin testing is a methodology where high resolution measurements are taken to determine finite changes in resistance. A Kelvin probe is a precision electrical contact with a current carrying component or reference point that eliminates or greatly reduces the effect of contact resistance. This is especially important when dealing with low millivolt reference voltages for high current testing.
 
Smiths Interconnect’s Kelvin probes leverage the same DNA and world class quality for which its standard spring probes are globally recognized in the semiconductor market. The product’s unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive. Designed into Standard Array test sockets or Volta WLCSP probe heads, Smiths Interconnect’s Kelvin probes provide a robust, low maintenance, long life test solution. For even longer life, Kelvin probes can be optimized with Smiths Interconnect’s proprietary homogenous alloy to deliver a high touchdown count HVM production solution.
 
“As industry requirements for precision analog, power, and RF test continuously evolve, Smiths Interconnect innovates our Kelvin product line to provide the most accurate testing for highest possible test yields.” said Rick Marshall, Global Business Development Director of the Semiconductor Test Business Unit at Smiths Interconnect.
 
Kelvin Probes feature several significant benefits including:
 

• 0.35mm pitch and above applications
• Four-terminal measurement for low resistance power and analog test
• Ease of maintenance
• Excellent signal integrity
• Self-cleaning top plunger design

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