4 Results
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Nov 09, 2021Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.
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Sep 01, 2021Smiths Interconnect Offers Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization, and Failure Analysis
Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.
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Sep 29, 2020Test Laboratory Expansion in Suzhou
The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.
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May 05, 2020Advanced Thermal Management IC Test Solutions
Utilizing state-of-the-art system simulation models allows Smiths Interconnect to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.