• November 30, 2022

Smiths Interconnect announces the expansion of its DaVinci Series to incorporate DaVinci 112 - ideal for testing some of the most complex functionality of Application Specific Integrated Circuits (‘ASICs’).

• July 14, 2022

The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.

• November 09, 2021

The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.

• September 01, 2021

Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.

• September 29, 2020

The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.

• July 20, 2020

Coaxial Test Solution for IC Testing to 67 GHz / 56 Gbps

• May 05, 2020

Utilizing state-of-the-art system simulation models allows Smiths Interconnect to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.

• May 13, 2018

The new 0.65mm pitch coaxial socket provides reliable and superior performance