Optimizing Production Test of QFN-packaged IC’s for Consumer, Automotive, Industrial and Power Applications.

• September 01, 2023

Where best-in-class electrical requirements intersect with a need for a small outline, low-profile footprint, IC designers are increasingly migrating to QFN packages. Meeting these testing challenges requires a test socket solution that is robust, reliable, and electrically “clean.”

Is it really that hard to improve chip test performance?

• August 08, 2022

In the digital era, semiconductor chips are present in almost every aspect of our lives. Whether it is from microwave ovens to computers, cell phones, computer central processing units, and other electronic devices there are a variety of chips installed.