Skip to content

TSX Wire Bondable Fixed Chip Attenuator Series

Excellent performance and power from DC-50 GHz

Banner Image ALT
  • TSX Wire Bondable Fixed Chip Attenuator Series are small, easy-to-implement, high-reliability product qualified for space and defence applications. The TSX WB2 Series is qualified to MIL-PRF-55342 and designed to offer excellent broadband performance up to 50-GHz, while delivering increased power handling in a small 0404 wire bondable package. It allows wider coverage than traditional components while providing optimized return loss for multiple frequency ranges.  This allows the customer to use a single chip in multiple applications, reducing the Bill of Material (BOM) item count and consequently, the cost of ownership.  The new TSX WB2 series can be ordered in group A, B or C testing based on MIL-PRF-55342.  Qualification data is included with product delivery for program assurance

Brochure
TSX

TSX Chip Attenuators offer excellent performance and power from DC-50 GHz in a small 0604 or 0404 package size.

Learn More

Features and Benefits

  • Small form factor - Reduces overall footprint
  • Space Qualified – Per MIL-PRF-55342
  • Wire Bondable – Ideal for chip and wire applications
  • Broad frequency range – Reduces BOM count
  • Low VSWR – Increases transmitted power
  • Wide range of attenuation values – 1-10, 15, 20 and 30dB
  • Tight attenuation tolerance – For optimal performance

Applications

  • Amplifier Circuits
  • Transmit/Receive Modules
  • Up/Down Converters
  • Instrumentation
  • Satellite Communications
  • Radar
  • 5G