Improving time- and cost- efficiency in reliability burn-in testing

• August 07, 2023

When companies develop new devices, they must ensure there are no failures in the field. This means that thorough reliability burn-in testing must take place from the start to avoid malfunctions down the road.

High-Power Burn-In Testing in 2023: How to Overcome the Extreme

• June 21, 2023

The tech zeitgeist is all about the extreme. The more advanced our devices become by the day, the more they evolve – and consumers’ expectations with them.

BGA Sockets To Solve All Your Electronics Testing Needs

• March 13, 2023

Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.

Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics

• February 14, 2023

Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.