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Overcome Challenges in Embedded Optical Interconnects Design
The emergence of IoT in cloud computing and the demand for 4G and 5G networks worldwide are driving the increased use of optical transceivers in a wide variety of applications: business, government, industrial, academic, and cloud servers in public and private networks. Both local area networks (LAN) and wide area networks (WAN) are demanding more bandwidth packed into smaller spaces, and traditional copper interconnects cannot satisfy the insatiable appetite of all the network servers and gateway devices. Furthermore, the next generation of networking devices will need to be even more compact and faster. According to market research firm Radiant Insight, the optical transceiver market will reach $9.9 billion by 2020, three times its 2013 level.
CTX SMT Series Test Report
CTX SMT Series Test Report pdf
High-density 12 transmitters plus 12 receivers rugged optical fiber transceivers
A novel optical fiber transceiver offering 24 lanes at up to 14 Gbps is presented; its external dimensions are 32.3 mm ×13.4 mm × 4.5 mm; it is compatible with the VITA66.4 standard or can be embedded on a host PCB; its operating temperature range is –40°C to 100°C.
Optical Interconnect Design Challenges in Space
More and more aerospace applications are incorporating fiber optics technology into their designs due to its many advantages over copper. The thinner fiber solutions provide higher speed over a longer distance, are more reliable, offer higher noise immunity and, in many cases, lower the cost of ownership.
The Internet of space and radiation hardened transceivers
We are on the verge of a new era of human connectivity and communications – the Internet of Space (IoS) is upon us. The explosion of worldwide communications over the past 25 years has led to the pervasive use of mobile and land communications equipment with an abundance of platforms, applications and devices all driving the growth of many of the largest businesses in the world. There is no doubt that this trend will continue through the Internet of Things (IoT), along with improvements to the underlying network infrastructure. However, the next, ‘Small Step’ for man in terms of ubiquitous communications will be the ‘Giant Leap’ into the Internet of Space.
Rugged Optical Transceivers for Embedded Computing Systems
The objective of this white paper is to show how important and critical optical interconnect is becoming in the development of high-performance embedded systems.
Parallel Optics for Embedded System
Fiber optics interconnect has emerged as the only viable technology to carry the massive amount of information generated by high resolution radars, infra-red cameras and other sensors. By: Gérald Persaud, VP Business Development and Michel Têtu, Senior Business Development Advisor
HBB Connector Series: when high-power fits in a small, light and reliable interconnect solution
The HBB Series is a high-power, high reliability family of connectors that incorporate hyperboloid contacts and are able to withstand extremely harsh environments
Fixture Preparation and RF Test of SMT Board Level Components at High Frequencies White Paper
Fixture Preparation and RF Test of SMT Board Level Components at High Frequencies White Paper pdf
A paradigm shift in simulation techniques of semiconductor test sockets
With the rise of the Internet of Everything (IoT), 5G, artificial intelligence (AI) augmented reality (AR), high performance test socket technology must keep pace.
Smiths Interconnect has expanded its presense in India
Opening up the Indian Market. Smiths Interconnect has expanded it's presence in India
Advantages using Semi-Rigid Cable Assemblies for Mission-Critical Applications
Advantages using Semi-Rigid Cable Assemblies for Mission-Critical Applications pdf