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Addressing Changing Standards to Meet Cable Assembly Requirements in New Space Applications

The shift in market trends from GEO to LEO and large satellites to constellation systems have introduced several changes to environmental and reliability requirements. This webinar will address the way these changes affect qualifications, lot acceptance tests, and reliability standards related to cable assemblies designed for new space applications.

Addressing Qualification Standards, Product Specifications and Environmental Factors for Passive RF Board Level Components in Space and Defense

This webinar will address customer’s adaptation of the current industry qualifications standards, product specifications and environmental factors for proper design and development of RF board level devices and components for new space and defense applications. The focus will be MIL-PRF-55342 and other military standards for passive RF component reliability, reducing lead time and cost of ownership.

Advanced Thermal Management for High-Power IC Test

Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.

Advantages and challenges of ceramic resonator RF & Microwave filter design in the UHF to the C-Band frequency spectra

Addressing the advantages and challenges of ceramic resonator RF & Microwave filter design in the UHF to the C-Band frequency spectra.

Advantages and Challenges of Planar Thin Film Bandpass Technology in RF Applications

Applications in the X, Ku and Ka bands require smaller size and weight components while providing high electrical response performance. In this webinar, Smiths Interconnect experts will address the advantages and challenges of RF filters that have reduced size and weight but also provide minimal loss in the passband and maximum rejection in the stopbands.

Antennas for Enabling UAV Line-of-Sight C2 and Data

Join our webinar on Monday October 20th 11am PDT to learn from our industry experts Engineering Director, Doug LaFreniere and Product Director, David Popelka as they share Antenna challenges focused on operational requirements, enabling technologies and product solutions.

Benefits and uniqueness of Hypertac® Hyperboloid contact technology for power charging solutions

Hypertac contact technology offers proven benefits and our engineering teams over the years continue to creatively adapt the concept to meet the needs of so many diverse applications. During this webinar our experts will discuss the key advantages of the technology and how it can aid the process of electrification in applications requiring power charging.

Custom Grid Array: high-density, robust and cost-effective RF performance for medical devices

In this webinar we will discuss the current and emerging trends of miniaturization and more cost effective solutions, and how this can be addressed using alternatives to traditional coax solutions.

Ferrite Isolators and Circulators for SSPA Applications

Solid state power amplifiers (SSPA) have been with us for decades. With each new generation of transistors and FETs SSPAs have extended their effective operating frequency and bandwidth, RF power and efficiency. As the years and technology have progressed, ferrite isolators, and in some cases circulators, have continued to provide a cost-effective solution to buffer the gain stages and protect the SSPA from reflected power.

Fretting Corrosion in Ruggedized Backplane Connectors

This webinar will focus on common contact technologies used in the connector industry and how to avoid fretting corrosion by implementing Hypertac® hyperboloid contact technology in your connector designs. This contact technology offers proven benefits and our engineering teams over the years continue to creatively adapt the concept to meet the needs of so many diverse applications.

High Frequency Spring Loaded Interposers for Space and Defence

How rugged, solderless Spring Probe Interposers solve the demanding board to board connectivity challenges

High performance backplane connectors for space

This webinar will focus on Smiths Interconnects' newly space qualified KVPX Backplane Connector. KVPX connectors are qualified to EEE-INST-002 Level 1 and are equipped with Hypertac® space-qualified 0.4 mm hyperboloid sockets and provide immunity to shock and vibration fretting, numerous linear paths of contact, low-forces, high mating cycles, and a self-wiping cleaning action that results in consistently better integrity in extreme environments.

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