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3U and 6U OpenVPX carrier cards for XMC , PMC and AcroPack I/O mezzanine modules (courtesy Acromag)

VPX Technology Development Trends

Security is a critical challenge for a wide range of embedded systems applications. System integrators must optimize operational capability, maximize competition for systems development, ensure interoperability, and maintain commonality to reduce life-cycle cost.

Overcome Challenges in Embedded Optical Interconnects Design

The above article has outlined the advantages and challenges of using fiber optical interconnects. To use fiber optic cables, the electrical signals need to be converted to light signals using fiber optic transceivers. While there are many challenges to embedded fiber optics design, the benefits are substantial. The guidelines and design check list provided will help developers select the best solutions for their needs.

Optical Interconnect Design Challenges in Space

Aeronautical applications face many design challenges that are unique to their intended environment. The best practices for optical interconnect design for space applications include the use of radiation-resistant technology to defend against space radiation, the use of components and devices that are designed to operate in harsh environments, and meeting size, weight, and power (SWaP) and long-term reliability requirements. Finally, it is recommended to follow open standards like VPX and to look for solutions that comply with MIL and quality standards.

Best Practices in Installation and Testing of Board Level Passive Components for Applications at Frequencies of Ka-Band and Above

As the applications in modern telecommunications shift towards K-band and Ku-band so does the need for RF components and systems at these frequencies.

8 Advantages to Know About Spring Probe Contact Technology in the Space Industry

The requirements of space flight components must be carefully taken in account when designing a spring-loaded connector.

Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s

As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.

The Internet of Space and radiation resistant transceivers

The explosion of worldwide communications over the past 25 years has led to the pervasive use of mobile and land communications equipment with an abundance of platforms, applications, and devices all driving the growth of many of the largest businesses in the world. There is no doubt that this trend will continue through the Internet of Things (IoT), and the arrival of the 5G technology along with improvements to the underlying network infrastructure. However, the next, ‘Small Step’ for man in terms of ubiquitous communications will be the ‘Giant Leap’ into the Internet of Space.