As next generation logic IC packages, network processors [NP], central processing units [CPU] and graphic processing units [GPU] become more powerful the amount of heat they generate increases exponentially.  Thermal management is a challenge all device manufacturers and test houses must overcome.

Smiths Interconnect’s Thermal Management Lid solutions are high value options, including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. We develop our solutions to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.  The off-the-shelf chiller unit is compact and uses very little space within the test lab.

Smiths Interconnect’s design team utilizes extensive system simulation models throughout product development to ensure an optimal solution for the specific test environment.

Smiths Interconnect Thermal Management Solutions Include:

• Finned Heatsink
• Liquid Cooled Heatsink
• Heatpipe | Heatsink
• Hi-Perform LC with Chiller (with optional Purge)

Hi-Perform Liquid Cooled 

Hi-Perform LC Lid options to be used with a chiller:

•  High Performance Liquid Cooled Lid (350W to 500W @ 85°C Case Temperature)
• High Performance Liquid Cooled Lid with Purge (350W to 500W @ 60°C or lower Case Temperature)
• There is an option to use a chiller with either style

Heatpipe | Heatsink Lid

 350W @ 85°C Case Temperature