Technical Features:

• For testing LGA, QFN, QFP and other variants ​
• Scrub action breaks through surface oxides on device pad ​
• Short signal path
• Tri-Temp socket design to support -55 °C to +150 °C​
• Configurable design flexibility for integrating into existing hardware setups   ​
• Designed for manual test, bench test, and HVM production test ​
• Insulator housing made from high-performance polyimide ​
• Small socket footprint 

Benefits:

• Long contact life, low wear, tested to over 500K insertions   ​
• Provides reliable and consistent contact for Matte Tin or NiPdAu pads, low consistent Cres​
• Exceptional signal integrity  ​
• Covers wide range of test applications​
• Match existing PCB socket footprint and test hardware lead to cost saving for customers​
• Field repairable, easy cleaning and maintenance​
• Low Dielectric constant, Low CLTE, exceptional Flexural Modulus​
• Allows for PCB topside components to be placed close to DUT for better signal performance and less signal loss