- Connector plug is offered with and without over-moulding and cabling
- Lightweight, robust, quick release, miniature connector
- IP67 sealing according to IEC529 when mated and unmated
- Full line EMI shielding and provide for high robustness throughout their lifetime
- Available in both circular (7, 13, 19 way) and rectangular (12, 21, 30 ways)
- Equipped with Hypertac Hyperspring contacts designed to protect the electrical interface against extreme environmental conditions.
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M12 Series Connectors
M12 connectors offer robust and compact connectivity solution that has been developed to address specific application environments where space and weight are key concerns. The M12 Series offer a time-saving, reliable and tool-free solution. Qualified to French and European rail standards.
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Smiths Interconnect unveils 2023 Distributors of the Year
The distribution awards initiative celebrates business partners who have contributed to the growth of Smiths Interconnect's business across the 3 regions in which it operates: Americas, EMEA and Asia.
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Smiths Interconnect awards top distributors for 2022
The distribution award initiative recognizes and celebrates the business partners whose efforts have contributed to advancing Smiths Interconnect’s business respectively in the Americas, EMEA and Asia. Winners were selected as best performing distributors in terms of sales growth compared to the previous year.
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FAQs at Smiths Interconnect: test sockets, capabilities, and support
After over 40 years of industry experience, Plastronics was acquired by Smiths Interconnect as the company’s one-stop shop for burn-in and reliability testing. As the complementary in-house burn-in division, we have also brought a wealth of knowledge and expertise in socket design and manufacturing.
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Challenges Semiconductor Package Size and Pitch Face in Shrinking Consumer Electronics
Tiny computers, smartphones, and small electronic devices that industry leaders and other companies have popularized are forcing the hand of semiconductor package designers to shrink the package to fit within these little hand-held gadgets. The demand for technology applications, such as smart homes, smart manufacturing, smart medical care, and automotive electronics, continues to increase. At the same time, the requirements of continuous miniaturization and functional diversification of electronic product demands also increase.