- Low, stable contact resistance throughout long insertion life
- Optimal signal integrity ≥ 40 GHz
- Accommodates reduced package size or footprint
- Advanced biasing techniques for RF power handling and elevated current carrying capacity
- High compliance with 1:3 travel to length ratio
- Reliable performance under conditions of heavy shock and vibration without contact interruption
- Renowned longevity in the field without sacrificing performance
- Advanced materials and plating expertise
- Easy, solderless installation and removal
- Rapid prototyping capabilities
- Spring probe arrays configured to match required footprint
- Integrated alignment, latching and sealing features