Standard Spring Probes
Standard probe series for 0.125 (3.18) pitch includes multiple length and travel options. Smiths Interconnect offers a wide range of Spring Contact Probes to meet your testing needs and has been recognized as a world leading provider for over 40 years.
| Probe | Probe OAL |
Max Travel |
Mating Receptacle |
|---|---|---|---|
| S-3 Series |
1.310 (33.27) |
0.250 (6.35) |
R-3 Series |
Dimensions are in inches (mm) | All specifications are subject to change.
| Receptacle | Insertion Tool | Crimping Pliers |
| R-3 Series | RT-3 | CP-3 (for 22-26 gage solid conductor) |
Standard probe series for 0.100" (2.54 mm) pitch includes multiple length, travel, ICT, lead free and rotator options.
Standard probe series for 0.156" (3.96 mm) and 0.187" (4.75 mm) pitches includes multiple length and travel options.
The impressive outcome of the trial not only attracted a major new contract, but also match-funding from the UK Space Agency that’s now enabling the establishment of a £3.8m single-site CAD-to-FAB facility in Dundee.
The explosion of worldwide communications over the past 25 years has led to the pervasive use of mobile and land communications equipment with an abundance of platforms, applications, and devices all driving the growth of many of the largest businesses in the world. There is no doubt that this trend will continue through the Internet of Things (IoT), and the arrival of the 5G technology along with improvements to the underlying network infrastructure. However, the next, ‘Small Step’ for man in terms of ubiquitous communications will be the ‘Giant Leap’ into the Internet of Space.
Reflex complements Smiths Interconnect’s product offering with the addition of a core fibre optic capability that will help address the needs arising from high speed data transmission in market segments requiring high reliability.
The SpaceABLE® Series allows the interconnection and routing of an overall throughput of more than 15 Terabit/s and permit the use of the full Ka beam antennas bandwidth while being considerably lighter and more scalable than copper interconnects.
