TestConX

Sun, 03 March, 2024 - Wed, 06 March, 2024
Mesa, AZ
Area Array Test Package on Package Test Peripheral Package Test Test Sockets Wafer Level Test WLCSP Probe Head

Visit Smiths Interconnect at Booth No. 47 & 48

1011 West Holmes Avenue
Mesa, Arizona, 85210-4923
USA
+1 480-833-5555

TestConX is the preeminent event for test consumables, test cell integration, and test operations.
TestConX has over the course of its twenty two-year history, established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope has expanded over these years from packaged semiconductor “final” test and burn-in to encompass all practical aspects of electronics testing including validation, advanced packaging testing, system level test, module test, and beyond to finished product test.