20 Results
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Nov 05, 2024Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards
The DaVinci 112 high-speed test socket is engineered to meet the rigorous demands of chip testing. It supports large-size chips up to 130x130mm with more than 30,000 input/outputs and a coplanarity tolerance of up to 0.65mm, effectively preventing connection issues due to poor coplanarity and ensuring superior signal integrity.
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Oct 09, 2024DaVinci technology shortlisted for 2024 IET Excellence & Innovation Award
Emerging Technologies have the potential to significantly impact and transform various industries, businesses, and society as a whole.
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Aug 29, 2024Smiths Interconnect to Participate in SEMICON Taiwan September 4-6
Amid this backdrop, Smith Interconnect will showcase a range of flagship testing products and AI testing solutions. Visit us at Hall 1 Booth 3190.
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Aug 23, 2024Smiths Interconnect's DaVinci 112 Test Socket Shortlisted for 2024 World Electronics Achievement Awards
The World Electronics Achievement Awards (WEAA) honor companies and individuals who have made outstanding contributions to the innovation and the development of electronics industry worldwide. WEAA are praised by many and represent one's leadership and excellent performance within the electronics industry.
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May 02, 2024Smiths Interconnect unveils 2023 Distributors of the Year
The distribution awards initiative celebrates business partners who have contributed to the growth of Smiths Interconnect's business across the 3 regions in which it operates: Americas, EMEA and Asia.
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Jul 13, 2023Smiths Interconnect announces breakthrough contact technology of Kepler test socket
Whether for testing high performance computing, wearables or other automotive chips, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.
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Jan 05, 2023Smiths Interconnect expands into burn-in test market with acquisition of Plastronics
The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
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Nov 30, 2022Introducing the next generation of high-speed test solutions
Smiths Interconnect announces the expansion of its DaVinci Series to incorporate DaVinci 112 - ideal for testing some of the most complex functionality of Application Specific Integrated Circuits (‘ASICs’).
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Aug 18, 2022Smiths Interconnect honored as Outstanding Test and Measurement Company of the Year at the China IC Achievement Award
Smiths Interconnect, a leading provider of innovative test solutions for the semiconductor industry, won the China IC achievement award as the Outstanding Test and Measurement Company of the Year for its continuous innovation and rapid growth in the Chinese market.
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Jul 14, 2022Smiths Interconnect expands DaVinci test socket offering
The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
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Nov 09, 2021Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
The unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive.
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Sep 01, 2021Smiths Interconnect Offers Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization, and Failure Analysis
Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.
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May 24, 2021Smiths Interconnect Unveils 2020 Distributors of the Year
Smiths Interconnect has recognized its valued distribution partners for their outstanding performance in advancing the company’s business across the world in 2020.
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Nov 30, 2020New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses
The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.
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Sep 29, 2020Test Laboratory Expansion in Suzhou
The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.
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Jul 20, 2020Next Generation DaVinci 56 Test Socket
Coaxial Test Solution for IC Testing to 67 GHz / 56 Gbps
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May 05, 2020Advanced Thermal Management IC Test Solutions
Utilizing state-of-the-art system simulation models allows Smiths Interconnect to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.
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Jan 02, 2020Enhancing Customer Efficiency with Volta 200
New Volta 200 Series Offers Easy Maintenance of Spring Probe Technology for Finest Pitch Wafer Test
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May 13, 2018DaVinci 45G Portfolio Extension
The new 0.65mm pitch coaxial socket provides reliable and superior performance
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Dec 06, 2017Volta Product Pushes Testing Technology Boundaries
A High Performance, Cost-effective Alternative in Wafer Level Chip Scale Package Testing