10 Results
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Sep 25, 2023
Smiths Interconnect expands product offering for demanding medical applications
The new D04 connectors offer high density while maintaining high cycle life.
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Oct 04, 2022
New Custom Grid Array technology for medical applications
Using spring probe and target contacts to deliver the same RF performance as cabled coaxial solutions, with improved signal integrity.
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Apr 11, 2022
Expanded product offering for disposable healthcare applications
The new disposable connector plug leverages the versatility of the Hypergrip® Series to deliver a reliable interconnect solution for single or few uses, ideal for applications that don’t require high cycle life but still require a premium disposable connector mated with a high cycle receptacle.
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Feb 25, 2021
Smiths Interconnect flies high on F-35 aircraft
We proudly supply different connectivity solutions to different customers that are destined for use in the F-35 aircraft,
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Nov 30, 2020
New Volta 180 supports Wafer Level Packages and Known Good Dies test businesses
The new Volta 180 Series is an advanced WLCSP test solution that expands Volta product line to include the compact 180um pitch, allowing for a higher number of chips to be tested on each wafer. It allows for a fast and reliable testing of wafers to ensure that they meet specifications and perform as they should, which translates into higher quality end products.
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Jul 20, 2020
Next Generation DaVinci 56 Test Socket
Coaxial Test Solution for IC Testing to 67 GHz / 56 Gbps
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Jan 08, 2020
Success of COSMO-SkyMed Programme
Smiths Interconnect's spring probe contact technology ensures the signal integrity of core electronics and antenna transmission.
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May 13, 2018
DaVinci 45G Portfolio Extension
The new 0.65mm pitch coaxial socket provides reliable and superior performance
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Feb 06, 2018
Choosing the Right Interconnect Systems for Medical
Guidelines for the effective selection of medical connector
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Dec 06, 2017
Volta Product Pushes Testing Technology Boundaries
A High Performance, Cost-effective Alternative in Wafer Level Chip Scale Package Testing