ES Micro Series H-Pin Socket | Smiths Interconnect

ES Micro Series H-Pin® Socket

ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors.

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Configurable design, In-house tooling and molds allow for the lowest cost of test.
An extensive catalog of standard parts reduces cost and lead time.
Double-latching clamshell provides ease of use during operation and clearance for lid operation.
Exceptional electrical performance provides wide RF bandwidth.

Feature Options

LGA, BGA, and package on package
Spring loaded plunger
Heat sink
HAST venting features
Integrated thermal control with heater and sensor
Reverse seating plane
Max component clearance under the DUT
High temperature materials for above 200 °C applications

Test Laboratory Expansion in Suzhou

The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.
Introducing the next generation of high-speed test solutions

Smiths Interconnect announces the expansion of its DaVinci Series to incorporate DaVinci 112 - ideal for testing some of the most complex functionality of Application Specific Integrated Circuits (‘ASICs’).
Smiths Interconnect expands DaVinci test socket offering

The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
BGA Sockets To Solve All Your Electronics Testing Needs

Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.