Skip to content
Login Register

SpaceNXT™ Ku Series

High Power Waveguide Circulators & Loads

The SpaceNXT™ Ku-Band High Power family of passive waveguide components are part of Smiths Interconnect’s overarching initiative to create a broad range of readily accessible space qualified waveguide Isolators, Circulators, Terminations, transitions, Hybrids and couplers operating in assigned bands from X to V-Band specifically for space applications.

Download Brochure

Features & Benefits

  • Guaranteed low and stable insertion loss under maximum power:
    • Circulators: 0.11 dB insertion loss with 20 dB minimum Return Loss over -25˚C to +125˚C
    • Loads: 20 dB minimum Return Loss over -25˚C to +135˚C
  • Multipaction and Corona Test Reports available
  • Proven Circulator design tested to 350 Watts CW Power. Unconditionally linear.
  • Proven Load design tested to 267 Watts average CW Power
  • Tested to meet Electro Magnetic Compatibility (EMC) specification to -80 dBi
  • Low Mass – Aluminum Housing with Chromate Finish
  • 40 years of Unrivalled Space Heritage
  • All testing in compliance with generic space qualification flow, incorporating industry standard power and environmental requirements

Overview

Smiths Interconnect’s SpaceNXT™ product portfolio provides customers with a combination of highly reliable technology and lower cost of ownership that enables operators to overcome potential market entry barriers while enjoying the benefits of an established technology partner.

The SpaceNXT™ Ku-Band High Power family of passive waveguide components are part of Smiths Interconnect’s overarching initiative to create a broad range of readily accessible space qualified waveguide Isolators, Circulators, Terminations, transitions, Hybrids and couplers operating in assigned bands from X to V-Band specifically for space applications.

Documents & Literature

Related News

  • Image of Burn in test products

    What is thermal simulation and why is it important to reliability burn-in testing?

    Not every semiconductor manufacturer utilizes thermal simulation in their reliability testing setup. Lower power burn-in allows for an acceptable temperature rise within the package/die in a traditional burn-in chamber running at 125°C. As packages in burn-in are moving to higher power output, socket and burn-in systems may need to have enhanced features to manage the desired target die temps.

  • Image of DaVinci test socket offering

    Smiths Interconnect expands DaVinci test socket offering

    The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.

  • Image of Custom Connectors VS Catalog Connectors: Benefit Breakdown and Challenges

    Custom Connectors VS Catalog Connectors: Benefit Breakdown and Challenges

    There's no escaping the expectations to create more compact electronic components with higher functionality. Designing shrinking electronics is a challenge for all electronics manufacturers. Whatever industry you're in and no matter if you’re creating consumer, business, or military-grade electronics, there is a demand for building smaller, smarter, and sturdier electronics.