- VSWR of 1.25:1 (typ) up to 10 GHz (max mated pair)
- Maximum overall diameter of 0.125" fitted into low-profile Micro-D housing
- Constant 50 Ohm airline impedance
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MDHC Series
Low VSWR up to 40 GHz (typ). These connectors have a constant 50 ohm airline impedance interface
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BGA Sockets To Solve All Your Electronics Testing Needs
Plastronics, a Smiths Interconnect technology brand, is a global provider of innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our company invented the first open-top, application-specific socket for production burn-in of LCC packages. This innovation helped semiconductor manufacturers significantly increase their throughput and decrease costs.
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Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s
As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.
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High-Power Burn-In Testing in 2023: How to Overcome the Extreme
The tech zeitgeist is all about the extreme. The more advanced our devices become by the day, the more they evolve – and consumers’ expectations with them.
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Improving time- and cost- efficiency in reliability burn-in testing
When companies develop new devices, they must ensure there are no failures in the field. This means that thorough reliability burn-in testing must take place from the start to avoid malfunctions down the road.