12 Results
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août 29, 2024
Smiths Interconnect to Participate in SEMICON Taiwan September 4-6
Amid this backdrop, Smith Interconnect will showcase a range of flagship testing products and AI testing solutions. Visit us at Hall 1 Booth 3190.
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août 23, 2024
Smiths Interconnect's DaVinci 112 Test Socket Shortlisted for 2024 World Electronics Achievement Awards
The World Electronics Achievement Awards (WEAA) honor companies and individuals who have made outstanding contributions to the innovation and the development of electronics industry worldwide. WEAA are praised by many and represent one's leadership and excellent performance within the electronics industry.
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juil. 13, 2023
Smiths Interconnect announces breakthrough contact technology of Kepler test socket
Whether for testing high performance computing, wearables or other automotive chips, Kepler is the only solution that provides two-axis of motion during a single actuation of the socket, an innovation set to pioneer the semiconductor test industry.
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janv. 05, 2023
Smiths Interconnect expands into burn-in test market with acquisition of Plastronics
The acquisition broadens the company’s offering and strengthens its position in the semiconductor test market.
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nov. 30, 2022
Introducing the next generation of high-speed test solutions
Smiths Interconnect announces the expansion of its DaVinci Series to incorporate DaVinci 112 - ideal for testing some of the most complex functionality of Application Specific Integrated Circuits (‘ASICs’).
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août 18, 2022
Smiths Interconnect honored as Outstanding Test and Measurement Company of the Year at the China IC Achievement Award
Smiths Interconnect, a leading provider of innovative test solutions for the semiconductor industry, won the China IC achievement award as the Outstanding Test and Measurement Company of the Year for its continuous innovation and rapid growth in the Chinese market.
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juil. 14, 2022
Smiths Interconnect expands DaVinci test socket offering
The request for increased functionality in the smallest possible footprint has led to a reduction of the pitch of integrated circuits below 500 μm. At the same time, increased performances in SoCs affect pin-to-pin noise or what is commonly called crosstalk during testing.
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sept. 01, 2021
Smiths Interconnect Offers Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization, and Failure Analysis
Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.
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sept. 29, 2020
Test Laboratory Expansion in Suzhou
The Centre of Excellence will offer a one-stop-shop to the global customer base for the products used in semiconductor test applications.
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juil. 20, 2020
Next Generation DaVinci 56 Test Socket
Coaxial Test Solution for IC Testing to 67 GHz / 56 Gbps
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mai 05, 2020
Advanced Thermal Management IC Test Solutions
Utilizing state-of-the-art system simulation models allows Smiths Interconnect to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.
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mai 13, 2018
DaVinci 45G Portfolio Extension
The new 0.65mm pitch coaxial socket provides reliable and superior performance