In this episode our experts Tim Wooden, Market Development Director for Semi Test business and Joshua Daniel, Product Line Manager will be diving into understanding the challenges of testing advanced semiconductors running at 224Gb/s PAM-4, specifically for AI and Hyperscale applications. Memory technology needs to run at speeds beyond 224Gb/s PAM-4 / 56 GHz Nyquist for Chip to Chip communication. Smiths Interconnect DaVinci coaxial test socket solution meets the current requirements of 112Gb/s PAM-4 and has been successful for the most stringent GPU/APU/TPU applications. It addresses the four main critical path requirements of voltage drop, crosstalk, power supply noise, and signal degradation.