Avionics - Board Level
Smiths Interconnect avionic board level solutions maximize system performance through unmatched signal integrity and mechanical endurance with a wide range of standard product and custom solutions.
- Product versatility and program heritage
- Reduced system costs due to immunity to shock and vibration
- Ability to operate under extreme temperatures
- Low insertion and extraction forces for reduced board strain and improved serviceability
Featured Products
Avionics - I/O
Smiths Interconnect avionic I/O solutions offer versatility in mounting options, with modular construction focusing on standard products as well as customer configured solutions. Our products have a proven pedigree providing application confidence with superior EMI shielding.
- Increased system level protection due to superior EMI filtering and transient protection options
- Modular construction provides design flexibility
- Optimized impedance matching for signal integrity
- Superior data transfer rates under extreme environmental exposure
Engine Systems
Smiths Interconnect engine system solutions offer superior hyperboloid contact technology resulting in higher temperature and vibration capability allowing for more sensors, monitoring and control systems to be located at or near the engine system.
- Extended contact life for increased MTBF and reduced system cost of ownership
- Modular construction of EMI/EMP filtering designed for high shock performance requirements (> 1,000 G’s)
- Significant performance at elevated temperature conditions beyond standard MIL Spec (> 260°C)
- Sensor positioning closer to the engine
Power Distribution
Smiths Interconnect power distribution solutions offer superior hyperboloid contact technology resulting in system stability as well as higher power handling, low contact resistance and temperature variants. Systems include overall power distribution, auxiliary power units, de-icing systems, power conversion and motor drives.
- High current-carrying capacity in a compact size
- Customer configurable architecture
- > 20 independent points of contact provide low voltage drop and minimize temperature rise
- High resistance to vibration and shock reduces maintenance cost
SATCOM Connectivity
Smiths Interconnect offers connectors and cable assemblies well suited to provide high performance and durability in harsh environments. Our RF/microwave components incorporate advanced resistive and signal distribution technologies for a broad range of frequency spectrum applications. Our embedded transceivers are ideal when high data rate communication links, low SWaP as well as radiation resistance performance are required.
- Excellent performance in a variety of environmental conditions
- Targeting high-reliability interconnects where high data rate communication links, low SWaP as well as radiation resistance performance are required
- Unparalleled average and peak power handling
- Standard and custom solutions to fit customers’ needs
Smiths Interconnect unveils 2023 Distributors of the Year
The distribution awards initiative celebrates business partners who have contributed to the growth of Smiths Interconnect's business across the 3 regions in which it operates: Americas, EMEA and Asia.
Thermopad Selector Tool Now Available
New tool helps user select the best Thermopad attenuator product for demanding high reliability applications.
New High Reliability TSX Fixed Chip Attenuator series for Space and Defense Markets
TSX Fixed Chip Attenuator series offers excellent performance and power from DC-50 GHz in a small 0604 package size qualified to MIL-PRF-55342.