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Best Distributors in Asia for 2019
The Distribution Awards 2019 were offered in three categories and went to Wai Tat Electronics Limited for absolute growth, to RFMW Asia PTE Ltd for relative growth and to RNB Korea Ltd for its design-in activity.
Smiths Interconnect Laboratory Replicates Deep Space
The Centre of Excellence will offer a one-stop-shop to the global customer base for the certification of products used in space applications
Enhancing Customer Efficiency with Volta 200
New Volta 200 Series Offers Easy Maintenance of Spring Probe Technology for Finest Pitch Wafer Test
Success of COSMO-SkyMed Programme
Smiths Interconnect's spring probe contact technology ensures the signal integrity of core electronics and antenna transmission.
SpaceNXT™ MWC Space Tested and Qualified Splitters
Addressing the need to create a streamlined procurement experience by shifting the testing responsibility away from the customer, Smiths Interconnect announces today the release of its SpaceNXT™ MWC Series of high reliability multi-way isolated splitters in high-frequency Ku-bands.
High performance wire bondable chip terminations
High power and frequency chip terminations in a compact, lightweight design Smiths Interconnect launches the new CTX series, offering high performance in a small package.
Distribution agreement with Heilind Electronics
The agreement with Heilind Inc. completes the business relationship already existing with Heilind in Europe and Asia, making the company a global partner for the distribution of Smiths Interconnect’s products.
COVID-19 Update
How Smiths Interconnect is supporting COVID-19 relief efforts.
New Planar X Series of RF Filters
Board level ceramic based thick film RF filters with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku Band).
KaStream receives Inmarsat Global Xpress approval
Tail-mount antenna system delivers commercial and military Ka-band worldwide coverage for Airborne Intelligence, Surveillance and Reconnaissance (ISR)
CEX Series Offers Excellent Slope Linearity
New CEX series provides optimized solutions for gain variation over frequency.
Advanced Thermal Management IC Test Solutions
Utilizing state-of-the-art system simulation models allows Smiths Interconnect to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms.