SmithInterconnect bringing technology to life

Visit us at Satellite 2018

Booth 943
Walter E. Washington Convention Center, Washington D.C

March 12-18th, 2018

Volta Series Probe Head for Wafer Level Chip Scale Package Test

Smiths Interconnect offers a high performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies.

Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.

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In the News

  • February 6, 2018

    Choosing the Right Interconnect Systems for Medical Device Designs Read Article

  • January 8, 2018

    Smiths Interconnect Presents First EMEA Distributor Award for 2017 Read Article

  • December 6, 2017

    Smiths Interconnect’s New Volta Product Pushes Testing Technology Boundaries Read Article

  • Product Showcase

    Volta Series Probe Heads Thumbnail Volta Series Probe Heads
    Smiths Interconnect’s Volta Series provides a cost-effective, high performance alternative to cantilever and vertical probe card technologies.” It’s not much different but really does describe what we’re offering. More

    DaVinci 45G Thumbnail DaVinci 45G
    The DaVinci sockets for high speed test offer a revolutionary solution for production ruggedness and signal integrity. The unique IM material used in DaVinci’s construction permits a truly coaxial structure from tip to tip, yielding the industry-leading bandwidths available from a highly compliant contactor More

    K2TVA Thermopad® Thumbnail K2TVA Thermopad®
    The K2TVA product family is the latest in next-generation Thermopad® product from Smiths Interconnect. This temperature variable chip attenuator provides unparalleled gain compensation in Ku, K, and Ka bands in an easy to implement totally passive wire-bondable package. More